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采用电子背散射衍射检验、硬度与电导率测试、拉伸试验、扫描电镜观察,研究强化固溶处理(470℃×2 h+480℃×2 h+490℃×2 h)对经T7652(2%~3%预压缩+121℃×5 h+153℃×16 h)处理的7085铝合金显微组织和力学性能的影响。结果表明:与经常规固溶(470℃×2 h)+T7652处理的7085铝合金相比,经强化固溶+T7652处理的合金平均晶粒尺寸由28.28188μm长大至31.18777μm,硬度由197.93 HV提高到200.18 HV,电导率基本不变,屈服强度从474.8 MPa提升至482 MPa,抗拉强度从537 MPa提升至542.3 MPa,伸长率则由12.575%下降到11.5%,断口裂纹多为沿晶扩展。
The effects of solution treatment (470 ℃ × 2 h + 480 ℃ × 2 h + 490 ℃ × 2 h) on T7652 (2) were studied by electron backscatter diffraction, hardness and conductivity test, tensile test and SEM observation. % ~ 3% pre-compression + 121 ℃ × 5 h + 153 ℃ × 16 h) treatment on the microstructure and mechanical properties of 7085 aluminum alloy. The results show that the average grain size of the alloy treated with strengthening solution + T7652 increases from 28.28188μm to 31.18777μm compared with that of 7085 aluminum alloy treated by conventional solid solution (470 ℃ × 2 h) + T7652, and the hardness increases from 197.93 HV increased to 200.18 HV, the electrical conductivity basically unchanged, the yield strength increased from 474.8 MPa to 482 MPa, the tensile strength increased from 537 MPa to 542.3 MPa, and the elongation decreased from 12.575% to 11.5% Crystal expansion.