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以温度和相对湿度为驱动势建立吸湿性墙体热湿耦合迁移数学模型,并通过权威案例验证模型。根据霉菌滋生条件,建立了基于瞬态温湿度及其持续时间的墙体内霉菌滋生风险评价方法。以红砖墙体为例,分析太阳辐射、室内空气温湿度对墙体内霉菌滋生风险的影响,并研究了我国南方各地墙体霉菌滋生风险。结果表明:太阳辐射越弱墙体内霉菌滋生风险越大,室内相对湿度升高使墙体内侧霉菌滋生风险快速增长,室内温度升高使墙体内、外侧霉菌滋生风险分别升高、降低;我国南方绝大部分地区墙体外侧存在霉菌滋生风险,总体上呈现东部比西部高、南部比北部高的趋势。
The temperature and relative humidity as the driving force to establish a mathematical model of heat-moisture coupling migration of hygroscopic wall, and through authoritative case validation model. According to the conditions of mold breeding, a risk assessment method of mold growth in wall based on transient temperature and humidity and its duration was established. Taking the red brick wall as an example, this paper analyzes the influence of solar radiation and indoor air temperature and humidity on the breeding risk of mold in the wall, and studies the risk of the growth of mold on the wall in southern China. The results showed that: the weaker the solar radiation, the greater the risk of mold in the wall, the higher the indoor relative humidity increased the risk of mold growth inside the wall, and the higher the indoor temperature, the higher and lower the risk of mold in and outside the wall. There is a risk of mold growth outside most of the southern part of China’s southern wall, showing a trend of higher eastern part than the western part and higher southern part than the north part.