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本文提出了利用化学力显微镜直接测量化学键强度的实验方法。其基本思想是设法使待测化学键形成于探针与样品之间,这可以通过适当的分子设计并对探针和基底进行修饰来实现。然后在成键的环境下(如液相、气相或光照等)测量探针与样品间的粘附力,并对其进行统计处理,,即可计算出键能。本文模拟硫醇在金表面上自组装膜的成膜过程,即在无水乙醇溶液中现场检测镀金探针与巯基为末端的自组装膜间的粘附力。然后用JKR粘滞理论计算实际成键个数。由此测得Au-S键能为34±5kcal/mol,与理论推算值基本接近。
In this paper, an experimental method for directly measuring the chemical bond strength by using a chemical force microscope is proposed. The basic idea is to try to make the chemical bond to be formed between the probe and the sample, which can be achieved by proper molecular design and modification of the probe and the substrate. And then bond in the environment (such as liquid, gas or light) to measure the adhesion between the probe and the sample, and its statistical processing, you can calculate the bond energy. In this paper, the film formation process of thiol self-assembled films on gold surface was simulated, that is, the adhesion between gold-plated probes and self-assembly films with thiol groups at the ends was detected in situ in anhydrous ethanol solution. Then use JKR viscosity theory to calculate the actual bond number. The measured Au-S bond energy was 34 ± 5 kcal / mol, which was close to the theoretical value.