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热风整平焊料涂覆技术是七十年代才发展起来的新技术。随着印制板工业发展的需要,热风整平焊料涂覆技术近年来发展很快。1980年9月美国GYREX公司来华技术座谈时介绍:当时全世界大约有热风整平装置200台,而在1982年4月加拿大Eietrovert公司来华技术讲座时透露:全世界大约有400台,不到两年热风整平装置的数量就增加了一倍。从机器的功能看,现在的热风整平机有手工操作的,半自动的,全自动的以及微处理机控制的流水线系统。从加工状态看,已经由垂直方向加工发展到水平方向加工。从生产速度看,已由120块/小时提高到500块/小时。由此可见,热风整平技术的发展是相当快的。
Hot air leveling solder coating technology is only developed in the seventies new technology. With the development of PCB industry needs, hot air leveling solder coating technology developed rapidly in recent years. September 1980 GYREX Technology Seminar in China Introduction: At that time, there were about 200 hot air leveling devices around the world. In April 1982, Eietrovert Technologies Canada came to China for technical lectures and disclosed that there are about 400 in the world and no The number of hot air leveling devices has doubled in two years. From the machine’s function, the current hot air leveling machine has a manual operation, semi-automatic, fully automated and microprocessor-controlled pipeline system. From the processing state, has been processed from the vertical direction to the horizontal processing. From the production rate of view, from 120 / hour to 500 / hour. Thus, the development of hot air leveling technology is quite fast.