Fabrication of 0.3-μm T-gate metamorphic AlInAs/GaInAs HEMTs on silicon substrates using metal organ

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我们在场与一个有效多级式的缓冲计划的介绍在 n 类型硅底层上用 Metalorganic 化学蒸汽免职(MOCVD ) 种的一只 InGaAs 变形高电子活动性晶体管(mHEMT ) 。高周波的 0.3-m 门长度弄空模式 Al0.50In0.50As/Ga0.47In0.53As mHEMT 的制造和性能第一次被报导。用一联合光并且电子横梁影印石版术技术, Si 上的亚微米 mHEMT 设备被完成了。合金得非的欧姆的接触抵抗 R c 象 0.065 公里一样低。直到 761 mS/mm 的最大的跨导被测
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