论文部分内容阅读
采用强脉冲电场条件下物理气相沉积的方法,通过大幅提高脉冲峰值电流的方式,获得晶粒尺寸细小的Ti纳米晶薄膜,并依次对薄膜的生长模式及相关性能进行了对比研究。结果表明:较大的峰值电流可以获得晶粒尺寸细小的Ti纳米晶薄膜,但峰值电流的增大不能改变薄膜内晶体以Ti(100)晶面择优生长。薄膜的表面生长形貌表现为随峰值电流的增大,颗粒间隙大幅降低、粒子团聚尺寸增大、整体呈现圆球状紧密生长的结构。截面生长形貌表现为随峰值电流的增大逐渐由纤维状向柱状形貌过渡,并有效降低薄膜的内部缺陷,致密度显著提高。力学性能表现为随峰值电流的增大,薄膜的硬度、模量都呈现出先增大后减小的变化趋势,且当峰值电流增大到30~45 A之间时,Ti薄膜的硬度与模量存在最大值。
By means of physical vapor deposition under intense pulsed electric field, Ti nanocrystalline thin films with small grain size were obtained by greatly increasing the pulse peak current, and the growth modes and the relative performances of the films were compared in turn. The results show that Ti nanocrystalline films with small grain size can be obtained by larger peak current, but the increase of peak current can not change the preferred growth of Ti (100) crystal in the films. The morphology of the surface of the film is characterized by an increase of the peak current, a sharp decrease of the particle gap, an increase of agglomeration size of the particle, and an overall spherical spheroid structure. The growth morphology of the cross section shows the transition from fibrous to columnar morphology with the increase of the peak current, and the internal defects of the film are effectively reduced, and the density is significantly increased. The mechanical properties showed that with the increase of the peak current, the hardness and modulus of the films all showed the trend of first increasing and then decreasing. When the peak current was increased to 30-45 A, the hardness and modulus There is a maximum amount of quantity.