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采用扫描电镜、能谱仪和微拉伸实验,研究了Cu/Sn-3Ag-0.5Cu/Cu引线对接焊点在373K不同热时效时间下焊点界面金属间化合物(IMC)的生长和抗拉强度的变化,同时对互连焊点的断口形貌及断裂模式进行了分析。结果表明:随着时效时间的延长,1)界面IMC不断增厚,其生长动力学符合抛物线生长规律;2)互连焊点的抗拉强度不断下降,其断裂模式由纯剪切断裂逐渐向微孔聚集型断裂转变。
The growth and tensile strength of interfacial intermetallic compound (IMC) at Cu / Sn-3Ag-0.5Cu / Cu lead butt joint under different thermal aging time of 373K were studied by scanning electron microscopy, energy dispersive spectroscopy and micro- Strength changes, at the same time, the fracture morphology and fracture pattern of the interconnection solder joints were analyzed. The results show that with the extension of aging time, 1) the thickness of IMC is continuously increased and its growth kinetics conforms to the law of parabolic growth; 2) the tensile strength of the interconnected solder joints declines continuously, and its fracture mode gradually increases from pure shear fracture Micropore aggregated fracture transition.