论文部分内容阅读
使用ANSYS有限元软件模拟研究了不同厚度基板下电弧熔积成形过程中的温度场、应力分布和基板的残余翘曲变形。计算结果表明:随着基板厚度的增加,成形件第一主应力的大应力区域面积逐渐缩小,成形件纵向残余应力最大值略有波动但相对稳定,基板翘曲变形减小,基板厚度对成形件变形和精度的影响也越来越小。模拟结果与试验测量结果具有良好的一致性,研究结论对电弧熔积增材成形工艺合理选择基板厚度具有理论和实际的指导意义。
ANSYS finite element software was used to simulate the temperature field, stress distribution and residual warpage of the substrate during the arc-forming process under different thicknesses. The results show that with the increase of the substrate thickness, the area of large stress area of the first principal stress of the forming part is gradually reduced and the maximum value of the longitudinal residual stress of the forming part is slightly fluctuated but relatively stable, the warping deformation of the substrate is reduced, The impact of deformation and accuracy is getting smaller and smaller. The simulation results are in good agreement with the experimental results. The conclusions of the study are of theoretical and practical significance to the rational selection of the thickness of the substrate by arc deposition additive forming process.