目前,国内大部分半导体硅二极管生产厂家在管芯成型的工艺上,仍一直沿用六十年代陈旧的点黑蜡掩蔽手工腐蚀方法(如图1、图2所示)把形成合适台面硅管芯一个个地分割下来.这种工艺存在着材料利用率低、管芯尺寸一致性差、产品电参数离散性大、化学试剂耗 At present, most of the semiconductor silicon diode manufacturers in China are still using the old black dot masking hand etching method in the 1960s (as shown in FIG. 1 and FIG. 2) to form a suitable mesa silicon die One by one split.This process there is a low material utilization, die size consistency is poor, the product of large discrete electrical parameters, chemical reagent consumption