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深入探讨了标准晶片级电迁移加速试验方法 ( SWEAT试验方法 )的试验原理、试验系统的建立、试验步骤及试验结果的分析等 ,并将在实践中总结出的试验经验和技巧介绍给大家。同时将该方法应用到生产实际 ,为工艺可靠性监测、研究电迁移失效机理与关键工艺的相关关系提供了有效手段。
In-depth discussion of the standard wafer-level electromigration acceleration test method (SWEAT test method) of the test principle, the establishment of the test system, test procedures and test results analysis, and will sum up in practice experimental experience and tips introduced to you. At the same time, the method is applied to the actual production, which provides an effective method for monitoring the reliability of the process and studying the relationship between the mechanism of electromigration failure and the key process.