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采用XRD和SEM研究了电沉积时间对电解镍的择优生长方向、晶粒大小、表面形貌和截面组织的影响。结果表明,随着电沉积时间的延长,电解镍的晶体生长方向会发生变化,由最初的(111)(200)面织构变为16 h后的(220)面织构;随着沉积过程的进行,电解镍的微观表面形貌由棱锥状慢慢变为胞状,生长机制由开始时的螺旋位错生长变为累积长大机制;电解镍的横截面组织由细晶粒层和较粗大晶粒层构成,属于非均匀沉积层,大部分晶粒呈柱状生长,并且垂直于始极片,晶粒大小沿沉积厚度呈阶梯状分布。
The effects of electrodeposition time on the preferred growth direction, grain size, surface morphology and cross-sectional structure of nickel electrode were investigated by XRD and SEM. The results show that with the increase of electrodeposition time, the crystal growth direction of the nickel electrode changes from the (111) (200) texture to the (220) texture after 16 h. With the deposition process , The micro-surface morphology of electrolytic nickel changed from pyramid to cytoplast gradually, and the growth mechanism changed from the initial helical dislocation growth to the cumulative growth mechanism. The cross-sectional structure of electrolytic nickel consisted of fine-grained layer and coarser Grain layer, belonging to non-uniform deposition layer, most of the grains grow in columnar shape, and perpendicular to the starting pole piece, grain size along the deposition thickness of the ladder-like distribution.