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采用自制的纳米银抗菌剂作为防霉抗菌添加剂,制备出了纳米改性水基助焊剂,并进行了可焊性和焊后可靠性测试。结果表明,该纳米改性水基助焊剂在可焊性测试开始后通过校正零轴的沾锡时间为1.4 s,最大润湿力为3.48 mN;经过24、96和168 h的潮热(85℃/85%RH)试验后,梳型电极未清洗条件下的表面绝缘电阻值最小值为2.1×109Ω,且表面无任何树枝状结晶物生成,远高于IPC-J-STD-004A标准要求值,具有优异的可焊性和焊后可靠性。
The self-made nano-silver antibacterial agent was used as the anti-mildew antibacterial additive to prepare the nano-modified water-based flux, and the solderability and post weld reliability test were carried out. The results show that the nano-modified water-based flux passes the zero-axis correction after the start of solderability test, and the maximum wetting force is 3.48 mN. After 24, 96 and 168 h of hot flashes ℃ / 85% RH), the minimum value of the surface insulation resistance of the comb electrode under unwashed condition is 2.1 × 109Ω, and no dendrites are formed on the surface, much higher than the requirements of IPC-J-STD-004A Value, with excellent weldability and post-weld reliability.