论文部分内容阅读
通过600℃/2 h真空退火,使复合电沉积的Ni-14.1 mass%Al膜(平均粒径为1μm)合金化,获得一种新型细晶Ni_3Al涂层.对比研究了该涂层与粗晶Ni_3Al合金900℃下50 h恒温氧化过程.结果表明,细晶涂层可快速生长连续Al_2O_3膜,导致NiO的生长受到明显抑制.与粗晶合金相比,该氧化膜粘附性更强.其原因可能在于氧化时细晶结构可抑制源自氧化膜的阳离子空位及Ni_3Al中因Al、Ni的互扩散所致的“Kirkendall”空位在氧化膜/基体界面沉积形成孔洞,提高了二者的结合强度.
The Ni-14.1 mass% Al composite electrodeposited with an average particle diameter of 1μm was alloyed by vacuum annealing at 600 ℃ for 2 h to obtain a new type of fine grained Ni 3 Al coating.Compared with the coarse grained Ni_3Al alloy at 900 ℃ for 50 h.The results show that the fine grained coating can rapidly grow continuous Al_2O_3 film and lead to the obvious inhibition of the growth of NiO.The adhesion of the oxide film is stronger than that of the coarse grain alloy The reason may be that the fine-grained structure inhibits the cation vacancies from the oxide film and the “Kirkendall” vacancies in the Ni_3Al deposited on the oxide film / matrix interface due to the mutual diffusion of Al and Ni in the oxide layer, The bond strength.