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高纯铝主要应用于半导体工业,约占95%。铝的最低纯度为99.999%,每种杂质的最大含量0.4ppb(十亿分之)。阴极溅镀靶在工业生产中,尤其是芯片制造时,阴极溅镀是一种必不可少的工艺,是一项纯高精技术。计算机储存硬盘通常是用高纯铝或高纯铝合金制造的。日本生产的硬盘占世界市场的70%。阴极溅射镀是一种特殊工艺,蒸发的铝呈等离子体状态,沉积于阴极靶面,即在硅片(Silicon wafer)上形成一层薄而均匀的铝膜,随后于其上涂一层感光树脂,经暴光后除去无用的树脂,也就是把这些部位的树脂去掉(腐蚀掉),而保留的极窄铝条便是所需要的导电体。阴极溅射镀用的高纯铝的纯度越高,其导电性能也越强。
High-purity aluminum is mainly used in the semiconductor industry, accounting for about 95%. The minimum purity of aluminum is 99.999% and the maximum content of each impurity is 0.4 ppb (parts per billion). Cathode sputtering target In industrial production, especially in the manufacture of chips, cathodic sputtering is an indispensable process and is a pure high-precision technology. Computer storage hard drives are usually made of high-purity aluminum or high-purity aluminum alloy. Hard disks made in Japan make up 70% of the world market. Cathode sputtering is a special process. The evaporated aluminum is in a plasma state and is deposited on the cathode target surface. That is, a thin and uniform aluminum film is formed on a silicon wafer and then coated with a layer of Photoresist, which removes unwanted resin after exposure, removes (erodes) the resin from these areas, leaving the very narrow strip of aluminum in place as the required electrical conductor. The higher the purity of the high-purity aluminum for sputtering, the more conductive it is.