集多个功能芯片于单一封装内的系统级封装(SiP)正成为业界的新宠,相比于传统的多芯片封装(MCP),系统级封装正朝着集成更多裸片、面积更小、更薄的方向发展,此外它还能大大节省CEM的设计时间,满足手机等对空间要求严格的便携电子产品需求并降低电路板的EMI噪声。因此,业界半导体巨头英特尔、飞利浦、三星和瑞萨科技等在SiP市场展开了一场新的竞赛。 System-in-Package (SiP), which packs multiple functional chips in a single package, is the industry’s darling of the industry as system-in-package packages are moving toward more die and smaller area than traditional multi-chip packages (MCPs) Thinner direction of development, in addition it can greatly save the CEM design time to meet the mobile phones and other space-demanding portable electronic products and reduce the EMI noise of the circuit board. Therefore, the industry semiconductor giant Intel, Philips, Samsung and Renesas Technology in the SiP market launched a new competition.