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为了分析一种导电胶的成分,利用热分析仪采用一次投样两次测试的方法,对导电胶进行DSC-TGA测试分析。通过对两次DSC-TGA测试曲线的分析、比对、计算及样品感观鉴别,排除有机物的干扰,半定量判定样品的化学成分及用量。得出此胶由无机物及有机物组成,其配比如下:二乙二醇甲醚约20%,乙基纤维素及其它未知有机物约1%,铝粉约40%,银粉约20%,低熔点玻璃粉及其它未知无机物约20%。此工作为利用热分析简便、快捷分析胶黏剂组分提供了一条新思路。
In order to analyze the composition of a conductive adhesive, a thermal analyzer was used to test the conductive adhesive twice by DSC-TGA. Through the analysis, comparison and calculation of two DSC-TGA test curves and the identification of samples, the interference of organic compounds was eliminated and the chemical composition and dosage of samples were semi-quantitatively determined. It is concluded that the gum consists of inorganic substances and organic compounds with the following proportions: about 20% of diethylene glycol methyl ether, about 1% of ethyl cellulose and other unknown organic compounds, about 40% of aluminum powder, about 20% of silver powder, Melting point of glass powder and other unknown inorganic about 20%. This work provides a new idea for the simple and quick analysis of adhesive components by thermal analysis.