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对T2纯铜板与AZ31B镁合金板以搭接接头形式进行激光填丝熔钎焊试验,研究了等热输入下激光功率对镁/铜界面附近物相结构、分布和接头性能的影响.结果表明,在适当的焊接工艺参数下可获得成形良好并具一定强度的镁/铜搭接接头,抗剪强度最大可达164.2 MPa,为镁合金母材的64%.激光功率较低时,镁/铜界面主要为极薄的Mg-Cu共晶组织.当激光功率较高时,从焊缝侧到铜侧,界面组织为α-Mg+(Mg,Al)2Cu共晶组织/Mg_2Cu+Cu_2Mg金属间化合物/Mg-Al-Cu三元化合物/Mg_2Cu+Cu_2Mg金属间化合物;焊缝侧到铜侧,硬度先增大而后突然减小,再缓慢增大,结合面附近达到最大硬度165 HV.金属间化合物是影响焊接接头性能的主要因素,接头在此处发生脆性断裂.
The effect of laser power on the phase structure, distribution and joint properties near the interface of Mg / Cu was studied under the condition of equal heat input by laser-filler brazing welding on T2 pure copper plate and AZ31B magnesium alloy plate. , Under appropriate welding process parameters can get well formed and with a certain strength of the magnesium / copper lap joints, the maximum shear strength of up to 164.2 MPa, 64% of the magnesium alloy base metal.When the laser power is low, the magnesium / When the laser power is high, the interface structure is α-Mg + (Mg, Al) 2Cu eutectic structure / Mg_2Cu + Cu_2Mg intermetallics Compound / Mg-Al-Cu ternary compound / Mg_2Cu + Cu_2Mg intermetallic compound; the weld side to the copper side, the hardness first increases then suddenly decreases, and then slowly increases to reach the maximum hardness of 165 HV near the interface. Compounds are a major factor affecting the performance of welded joints where brittle fracture occurs.