论文部分内容阅读
AMD(NYSE:AMD)及IBM(NYSE:IBM)近日宣布两家公司已达成协议,同意合作开发适用于生产新一代高性能产品的芯片工艺技术。 AMD及IBM合作开发新的工艺技术,目的是要提高微处理器的性能及降低其功耗,而新的工艺技术将采用先进的结构及材料如高速绝缘硅芯片(SOI)晶体管、铜导线互连及更有效的“低k电介质”绝缘材料等。 这项协议的内容包括合作开发65
AMD (NYSE: AMD) and IBM (NYSE: IBM) recently announced that the two companies have agreed to cooperate in the development of chip technology suitable for the production of a new generation of high-performance products. AMD and IBM have teamed up to develop new process technologies aimed at increasing the performance and power consumption of microprocessors. The new process technology will employ advanced structures and materials such as high-speed silicon-on-insulator (SOI) transistors, copper wire Even more effective “low-k dielectric” insulation materials. The agreement includes co-development65