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研究了化学镀 Ni-W-B 合金的工艺及性能。结果表明,在 Ni-B 槽液中加入一定量的钨酸钠溶液,不仅能得到含 W、B 的镀层,而且还能提高镀液的沉积速度;Ni-W-B 合金层的电阻率随钨含量的增加而增大,随镀层厚度的增加而降低。
The technology and performance of electroless Ni-W-B alloy plating were studied. The results show that adding a certain amount of sodium tungstate solution into Ni-B bath can not only get the coating containing W and B, but also increase the deposition rate of the bath. The resistivity of Ni-WB alloy increases with the increase of tungsten content Increase with the increase of coating thickness decreases.