In this paper, we comprehensively investigate the influences of M(M=Cu, Co, Mn) substitution for Ni on the structures and electrochemical hydrogen storage chara
Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more dif
The microstucture,mechanical properties and fracture behaviors of semi-continuous cast Mg-8Gd-3Y-0.5Zr(wt.%,GW83K) alloy after different heat treatments were in