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利用波长355nm的纳秒激光和1064nm的皮秒激光对蓝宝石基片进行刻槽及切割实验,通过控制变量法研究了微槽深度、宽度及质量随工艺参数变化的情况,并进行对比分析。结果表明,355nm纳秒激光加工过程存在很大的热作用,而且刻蚀效率低,即使其峰值功率密度达到109 W/cm2也不能实现对蓝宝石毛坯片的图形切割;而1064nm皮秒红外激光切割微槽的质量很高,几乎可实现完全的“冷加工”。最后,通过分析总结,认为激光峰值功率密度达到1012 W/cm2可实现对蓝宝石基片的图形切割,且利用平均功率1 W、单脉冲能量1mJ、脉宽15ps的1064nm红外激光,实现了0.55mm厚蓝宝石毛坯基片的高质量图形切割。
The sapphire substrates were grooving and cutting experiments by using the 355nm nanosecond laser and the 1064nm picosecond laser. The variation of microgroove depth, width and mass with process parameters was studied by control variable method, and the comparative analysis was carried out. The results show that 355nm nanosecond laser processing has a great thermal effect, and the etching efficiency is low, even if the peak power density reaches 109 W / cm2 can not achieve the sapphire blank slice pattern cutting; and 1064nm picosecond infrared laser cutting The microgrooves are of very high quality and can almost completely “cold work”. Finally, the analysis concluded that the laser peak power density of 1012 W / cm2 can be realized on the sapphire substrate cutting, and the use of average power of 1 W, single pulse energy of 1mJ, pulse width 15ps 1064nm infrared laser to achieve 0.55mm High-quality graphic cutting of thick sapphire substrate.