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研究了Ti/Ni/Ti复合层TLP扩散连接Si3 N4 陶瓷。结果表明 ,Ni Ti过渡液相存在时间短 ,在此期间形成的界面结合强度低 ;必须进一步固态扩散反应才能形成高强度接头 ,相应的接头显微结构为 :Si3 N4 /TiN/Ti5Si3+Ti5Si4 +Ni3 Si/NiTi/Ni3 Ti/Ni。连接时间、连接温度、连接压力及Ti和Ni的厚度影响接头组织和强度 ,其最佳值为 6 0min ,10 5 0℃、2 .5MPa、2 0 μm和 40 0 μm ,所得接头室温和 80 0℃剪切强度分别为 142MPa和 6 1MPa。
The TLP diffusion bonding of Ti3N4 / Ti / Ni / Ti composite layers was investigated. The results show that the NiTi transient liquid phase exists for a short time, and the interfacial bonding strength is low during this period. The solid state diffusion reaction must be followed to form the high strength joint. The corresponding microstructure of the joint is Si3N4 / TiN / Ti5Si3 + Ti5Si4 + Ni3 Si / NiTi / Ni3 Ti / Ni. The connection time, connection temperature, connection pressure and the thickness of Ti and Ni affect the microstructure and strength of the joint. The optimal values are 60 min, 105 ℃, 2.5 MPa, 20 μm and 40 0 μm. The shear strength at 0 ℃ is 142MPa and 6 1MPa respectively.