论文部分内容阅读
2017年5月31日,由欧盟支持、英飞凌领导、欧洲26家单位共同参与的eRamp项目结束。在为期3年的研究中,研究团队聚焦于更节能的封装技术等新制造技术,实现了创新性、更具能效的电子器件,研究结果在半导体生产环境中进行了实际制造能力检验,成为欧盟300毫米晶圆功率电子发展史上的又一里程碑。项目背景对于欧洲功率电子器件制造商而言,其至关重要的事情之一是可快速获取
On May 31, 2017, the eRamp project, which is supported by the EU and led by Infineon, with the participation of 26 European units, ended. During the three-year study, the research team focused on new manufacturing technologies such as more energy-efficient packaging technologies to enable innovative and more energy-efficient electronic devices. The research results were tested in actual manufacturing capabilities in a semiconductor manufacturing environment to become the EU 300 mm wafer power electronics in the history of another milestone. Project Background One of the crucial things for European power electronics manufacturers is their quick access