Si和GaAs衬底上生成WN_x薄膜(英文)

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WNx films with different composition are formed on Si(100) and GaAs (100) by the reactive rf sputtering in a mixed nitrogen-argon gas to study the influence of various conditions upon WNx film,- one of the most promising materials for self-aligned GaAs MESFET. With the increase of the partial pressure ratio of nitrogen gas or the decrease of sputtering pressure, the deposition rate of WNx film decreases and the atomic percentage of N in the film increaces until it is saturated. Annealing at high temperature in flowing H2 gas induces the decreace of atomic percentage of N in WNx film. After annealing at 900℃ for 30 minites in flowing N2 gas, WNx film formed at lower sputtering pressure is found to have W and W2N, and to have W, WN and/or W2N phase at a higher sputtering pressure. AES analysis shows no conspicuous diffusion after annealing. The electrical resisti vity of WNx film decreases by about 75% as compared with that of as-sputtered film. WNx films with different compositions are formed on Si (100) and GaAs (100) by the reactive rf sputtering in a mixed nitrogen-argon gas to study the influence of various conditions upon WNx film, - one of the most promising materials for self- With the increase of the partial pressure ratio of nitrogen gas or the decrease of sputtering pressure, the deposition rate of WNx film decreases and the atomic percentage of N in the film increaces until it is saturated. Annealing at high temperature in flowing H2 gas induces the decreace of atomic percentage of N in WNx film. After annealing at 900 ° C for 30 minites in flowing N2 gas, WNx film formed at lower sputtering pressure is found to have W and W2N, and to have W, WN and / or W2N phase at a higher sputtering pressure. AES analysis shows no conspicuous diffusion after annealing. The electrical resisti vity of WNx film decreases by about 75% as compared with that of as-sputtered film.
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