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研究了不同退火温度及退火时间对W-20%Cu复合材料微观组织、硬度、抗拉强度、导电率、密度的影响。结果表明,W-20%Cu复合材料退火温度为750~950℃,随温度升高,导电率和硬度先升高后降低;800℃与900℃分别退火0.5~6 h,导电率下降,硬度先升高后降低。800℃×0.5 h时的W-20%Cu复合材料的导电率相对较高,为47.32%IACS(国际退火铜标准),900℃×1 h时材料硬度相对较高,为285 HB。
The effects of annealing temperature and annealing time on microstructure, hardness, tensile strength, electrical conductivity and density of W-20% Cu composites were studied. The results show that the annealing temperature of W-20% Cu composites is 750-950 ℃. With the increase of temperature, the electrical conductivity and hardness first increase and then decrease. Annealing at 800 ℃ and 900 ℃ for 0.5-6 h, respectively, First increase and then decrease. The electrical conductivity of W-20% Cu composites at 800 ℃ × 0.5h was relatively high, 47.32% IACS (International Annealed Copper Standard). The hardness of the W-20% Cu composites was 285 HB at 900 ℃ for 1 h.