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采用MEMS(MicroelectromechanicalSystems)技术研制了镍(Ni)膜微桥结构试样,应用陶瓷压条为承力单元,与纳米压痕仪XP系统的Berkovich三棱锥压头相结合,解决了较宽Ni膜微桥加载问题。测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了Ni膜微桥的杨氏模量及残余应力,其值分别为190.5GPa和146MPa,与应用纳米压痕仪直接测得的带有Si基底的Ni膜杨氏模量186.8±7.34GPa相吻合。
A nickel (Ni) film micro-bridge structure sample was developed by using MEMS (Micro Electromechanical Systems) technology. The application of ceramic bead as bearing unit combined with Berkovich triangular pyramid head of nano-indenter XP system solved the problem of widened Ni film Bridge loading problem. The relationship between the load and the displacement of the micro-bridge was measured. Young’s modulus and residual stress of the Ni-film micro-bridge were calculated based on the theoretical model of micro-bridge mechanics. The values were 190.5GPa and 146MPa, respectively. Ni film with Si substrate has a Young’s modulus of 186.8 ± 7.34 GPa.