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为了更好设计LED液冷换热热沉,提高大功率LED热沉的综合换热性能,模拟计算了三种结构热沉的LED芯片最高结温和器件热阻,运用场协同原理分析了不同LED热沉结构的换热原理,以及努塞尔数和摩擦因子随雷诺数的变化规律;并用强化传热因子来表述换热能力和流动阻力的综合换热效果。结果表明,运用30°角矩形翅片的LED结温和器件热阻最低,换热能力最好;菱形翅片次之,垂直平行翅片最差。30°角矩形翅片和菱形翅片由于倾斜角的存在,在增加换热能力的同时也增加了流动阻力;综合分析换热能力和流动阻力,菱形翅片的综合换热性能最好。
In order to better design LED liquid-cooled heat transfer heat sink and improve the comprehensive heat exchange performance of high-power LED heat sink, the maximum junction temperature and device thermal resistance of LED chips in three kinds of structure heat sinks are simulated and calculated. Heat transfer principle of heat sink structure, the law of Nusselt number and friction factor with Reynolds number, and the comprehensive heat transfer effect of heat transfer capacity and flow resistance are expressed by the enhanced heat transfer factor. The results show that the LED junction temperature and device thermal resistance of the 30 ° angle rectangular fin is the lowest, the heat exchange capacity is the best; followed by the diamond fins and the vertical parallel fins are the worst. Due to the existence of inclined angle, the 30 ° angle rectangular fins and diamond fins increase the heat transfer capacity and increase the flow resistance at the same time. The comprehensive heat exchange performance and flow resistance of diamond fins are the best.