日本电电公司武藏野电气通信研究所,最近试制成功了在硅片上,直接描绘出亚微米精密图形的高精度电子束曝光装置(EB55)。这个研究所的精密加工研究室,为了提高超大规模集成电路的性能,使电路中的元件尽量精密化,达到高密度化,而研究试制了可以直接描绘出 Japan's Musashino Electric Musashi Institute of Electrical and Telecommunications, the recent successful trial on the silicon wafer, the direct description of the sub-micron precision graphics high-precision electron beam exposure device (EB55). The Institute of precision machining laboratory, in order to improve the performance of very large scale integrated circuits, the circuit components as much as possible to achieve high density, and research and trial can be directly drawn