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高密度多层互连技术(HDMI)很有可能是未来的封装技术,利用这种技术可以在硅、陶瓷和玻璃基板上互连硅芯片。体积更小、速度更快、价格低廉和性能可靠的系统的广泛需求使许多电子产品封装都采用HDMI。 HDMI具有如下几方面优点:1.每平方英寸基板上能容纳更多的电路,HDMI的封装效率(基板面积和半导体所占据的面积的比)高于90％,这比人们普遍认为是最佳封装密度的圆片集成的封装效率还高40％;2.印脚减少给三维叠层HDMI晶片阵列带来可行性,这
High-density multi-layer interconnect technology (HDMI) is likely to be the future of packaging technology, the use of this technology can be silicon, ceramic and glass substrates interconnect silicon chips. The widespread demand for smaller, faster, less expensive and more reliable systems has enabled HDMI for many electronics packages. HDMI has the following advantages: 1. Per square inch of substrate to accommodate more circuits, HDMI package efficiency (substrate area and the area occupied by the semiconductor) is higher than 90%, which is generally considered to be the best Packaging efficiency of the package wafer packaging efficiency is 40% higher; 2. Feet reduced to three-dimensional stacked HDMI chip array to bring the feasibility of this