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转移印刷是一种新技术,它能将大量高性能半导体器件并行装配到几乎所有的基材上,包括玻璃、塑料、金属或其他半导体材料。这种半导体转印技术利用弹性移印头从源硅片有选择性地拾取器件,然后将这些器件印刷到目标基材上。其关键技术是调整弹性移印头与半导体器件的黏附能力。转移过程是大批量并行的,可一次转印成千上万个器件。研究结果表明,99.9%以上的此类产品是可以通过转印实现的。此外,印刷芯片的放置精度小于±5μm。
Transfer printing is a new technology that enables a large number of high-performance semiconductor devices to be mounted in parallel on nearly all substrates, including glass, plastic, metal or other semiconductor materials. This semiconductor transfer technology uses a flexible pad to selectively pick up devices from the source wafer and then print the devices onto the target substrate. The key technology is to adjust the flexible printing head and the adhesion of semiconductor devices. The transfer process is massively parallel and can transfer tens of thousands of devices at once. The results show that more than 99.9% of these products can be transferred by transfer. In addition, the printed chip placement accuracy of less than ± 5μm.