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用激光加工微细孔是高密度PCB制造的关键技术之一,由于铜对于10μm左右波长激光的反射率很高,在使用CO2激光打孔时能量过大会造成铜箔突起和裂纹,能量过小加工无法进行须采用保型掩模技术,这使得加工步骤增加,工艺复杂。通过研究几种加强铜箔对激光能量吸收的方法,提出可以用CO激光直接打孔,简化了加工步骤。
Machining micropores with laser is one of the key technologies in high-density PCB manufacturing. Since copper has a high reflectivity for laser light with a wavelength of about 10 μm, excessive energy during the drilling with a CO2 laser causes protrusions and cracks in the copper foil and low energy processing Unable to be used to ensure the use of mask technology, which makes the processing steps to increase the complexity of the process. By studying several ways to enhance the laser energy absorption of the copper foil, it is proposed that the laser can be directly perforated with a CO laser to simplify the processing steps.