目前世界 MOSIC 生产线目前有多种加工精度存在,如果按不同加工精度区分的话,0.7μm以上的工艺加工能力增加了3.3%,,增长到每周23万7800片;0.4μm以上不足0.7μm间的工艺加工能力减少了13.3%,降到每周16万7600片,0.3μm以上不足0.4μm间的工艺加工能力增加了5.4%,增加到每周19万4800片;0.2μm以上,不足0.3μm之间的工艺加工能力减少了28.4%,,降为每周16万8000片;0.2μm以下的工艺加工能力增加了19.3%,增加到每周38万 At present, there are many kinds of machining accuracy in the world MOSIC production line. If differentiated according to different processing accuracy, the processing capacity of 0.7μm or more is increased by 3.3% to 230,800 pieces per week; between 0.4μm and less than 0.7μm The processing capacity was reduced by 13.3% to 166,000 wafers per week. The processing capacity between 0.3μm and less than 0.4μm increased by 5.4% to 794,800 wafers per week; 0.2μm or more, less than 0.3μm. The processing capacity between the two processes was reduced by 28.4%, to 160,000 per week; the processing capacity below 0.2μm increased by 19.3% to 380,000 per week.