高压大功率器件,在开关稳压电路、驱动电路、电机调速、汽车点火器和彩色电视机偏转电路中应用十分广泛.随着科学技术的进步,电路设计者对它的性能和参数的要求越来越苛刻,目前,特别是在制造大电流、高电压和高可靠性器件的工艺上还存在着某些问题.本文为了解决这些问题,着重对衬底扩散、台面成型、玻璃钝化和背面金属化工艺进行探讨. High-voltage high-power devices, switching regulator circuit, drive circuit, motor speed control, auto ignition and color TV deflection circuit is widely used with the advancement of science and technology, circuit designers its performance and parameters More and more harsh, at present, especially in the manufacture of high current, high voltage and high reliability of the device there are still some problems.In order to solve these problems, this article focuses on the substrate diffusion, table top molding, glass passivation and The back of the metal process to explore.