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第12届电子封装技术和高密度封装国际会议(ICEPT-HDP2011)将于2011年8月8日~11日在中国上海举行。会议由中国电子学会电子制造与封装技术分会(EMPT)主办,由上海大学承办。
The 12th International Conference on Electronic Packaging Technology and High-Density Packaging (ICEPT-HDP2011) will be held in Shanghai, China from August 8 to 11, 2011. The conference is sponsored by the Electronic Manufacturing and Packaging Technology Branch (EMPT) of the Chinese Institute of Electronics and hosted by Shanghai University.