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第十三届电子封装技术和高密度封装国际会议(ICEPT-HDP2012)将于2012年8月13日16日在中国桂林举行。会议由中国电子学会电子制造与封装技术分会(EMPT)主办,由桂林电子科技大学承办。
The 13th International Conference on Electronic Packaging Technology and High-Density Packaging (ICEPT-HDP2012) will be held on August 16, 2012 in Guilin, China. The conference is sponsored by the Electronic Manufacturing and Packaging Technology Branch of China Institute of Electronics (EMPT) and hosted by Guilin University of Electronic Technology.