本发明是有关硬质脆性板的分离法,这种方法主要是把半导体硅片分离成小片为对象。在半导体器件的制造中,通常采用下述方法:即先在被切成薄片的一片半导体硅片上,形成纵横排列的很多的单元(元件),然后,再将其分离成含有各自单元的半导体小片。对这种半导体硅片分离时,是先采用划片工序,在半导体硅片表面上,按格栅形状,划出断面为V形的划线沟道,然后再在其上用滚子滚动,并通过从上面施加机械力的办法,使硅片强制弯曲,沿着划线沟的方向被分割成 The present invention relates to a method of separating a hard brittle plate. This method mainly separates a semiconductor wafer into small pieces. In the manufacture of semiconductor devices, generally, a method is employed in which a large number of cells (elements) arranged in vertical and horizontal directions are formed on a single piece of semiconductor wafer sliced ​​in a thin film, and then separated into semiconductors including respective cells Small pieces. The separation of such semiconductor wafers, the dicing process is first used in the semiconductor wafer surface, according to the shape of the grid, draw a cross-section of the V-shaped scribed trench, and then on it with the roller rolling, The silicon wafer is forcibly bent by applying a mechanical force from above and is divided into