论文部分内容阅读
为了研究LED模组的散热性能,对其基板的横向和纵向散热性能进行了对比研究。首先建立加快基板横向和纵向散热性能的有限元模型,即在基板上覆盖高导热层和基板内添加高热导率热沉结构。并运用有限元(FEM)分析方法对两种基板的散热效果以及基板和LED芯片温度分布的均匀性进行了对比分析。最后,对于基板上覆盖高导热层的结构,结合实际工艺和散热性能的考虑,进一步优化了高导热层的厚度。
In order to study the thermal performance of the LED module, the horizontal and vertical heat dissipation performance of the substrate is compared. Firstly, a finite element model of accelerating the lateral and longitudinal heat dissipation of the substrate is established, that is, a high thermal conductivity layer is covered on the substrate and a high thermal conductivity heat sink structure is added into the substrate. Finite element (FEM) analysis method is used to analyze the heat dissipation effect of the two substrates and the uniformity of the temperature distribution of the substrate and the LED chip. Finally, considering the structure of the substrate covered with the high thermal conductivity layer and considering the actual process and the heat dissipation performance, the thickness of the high thermal conductivity layer is further optimized.