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研究了微量稀土元素Nd的添加对Sn-6.5Zn合金组织及钎料/Cu焊点界面金属间化合物(IMC)特征的影响。结果表明:微量Nd元素在Sn-6.5Zn钎料中的添加能够显著细化合金组织和形成均匀细密界面IMC层;添加0.1wt%Nd元素即能促进钎料/Cu焊点界面反应及界面区域成分的均匀性。
The effect of Nd addition on the microstructure of intermetallic compound (IMC) in Sn-6.5Zn alloy and solder / Cu solder joint was studied. The results show that the addition of trace amounts of Nd in Sn-6.5Zn solder can significantly refine the microstructure and form a uniform and fine interfacial IMC layer. Addition of 0.1wt% Nd can promote the interfacial reaction and interfacial region Uniformity of ingredients.