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本文研究了采用钎料重熔工艺制造的混合集成电路,目的是使电路充分微型化并显著地降低成本。将薄膜电阻和电容网络(R-C)芯片以及硅集成电路芯片外贴在多层厚膜布线的基片上,并用软钎焊与基片连接,开始时芯片为钎料凸点所支承,接着,在钎料的重熔过程中这些芯片借助钎料的表面张力进行自动对正。采用这种工艺所制造出来的接点可以补偿基片的偏移和波动。混合集成电路的机械支承和电气连接只要通过一次重熔过程就都完成了。已经证明这些混合集成电路是完全令人满意的和可靠的。
In this paper, a hybrid IC fabricated using a solder remelting process is studied in order to fully miniaturize the circuit and significantly reduce the cost. The thin film resistor and capacitor (RC) chip and the silicon integrated circuit chip are pasted on the substrate of the multilayer thick film wiring and are connected with the substrate by soldering. At the beginning, the chip is supported by the solder bumps. Then, These chips are automatically aligned with the surface tension of the solder during remelting of the solder. Contacts fabricated using this process can compensate for substrate shifts and fluctuations. Mechanical support and electrical connections for hybrid ICs are done with just one remelting process. These hybrid integrated circuits have proven to be completely satisfactory and reliable.