半导体器件的性能及其稳定性在很大程度上依赖于晶体表面的加工质量和表面层的结构。晶体不同类型的机械加工(切割、研磨,抛光)使表面晶体点阵破坏,从而严重影响到它的光学、电和光电性能及其他特性。因 The performance and stability of semiconductor devices depend largely on the processing quality of the crystal surface and the structure of the surface layer. Different types of crystal machining (cutting, grinding, polishing) to the surface crystal lattice damage, which seriously affected its optical, electrical and optical properties and other features. because