最新消息显示,半导体大厂台积电计划联合ARM、Xilinx、Cadence共同打造全球首个基于7nm工艺的芯片,届时他们将采用7nm Fin FET工艺,制造一类似CCIX(缓存一致性互联加速器)测试芯片,等到明年第一季度会完成流片,2018年下半年开始出货。据了解,这种CCIX芯片可以快速在各元件端顺利存取和处理资料,不受限于资料存放的位置以及复杂的程式开发环境。能够实现全程在存储器内运行 According to the latest news, the semiconductor giant TSMC plans to jointly build the world’s first 7nm-based chips with ARM, Xilinx, and Cadence, and will use a 7nm Fin FET process to create a CCIX-like test chip. Wait until The first quarter of next year will be completed film, the second half of 2018 shipments. It is understood that this CCIX chip can quickly smooth access and processing of information in the various components, not limited to the location of data storage and complex programming environment. Can achieve full operation in memory