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微波等离子体处理木材表面时引起蚀刻，蚀刻程度的大小与离子能量水平，即与等离子体工作条件和等离子体种类密切相关。本文讨论了微波等离子体工作条件即微波功率、系统压力、样品位置（距谐振腔距离）及处理时间对杉木木材蚀刻的影响，并在相同工作条件下，比较了Ｎ２、Ｏ２及空气等离子体对木材蚀刻程度的影响。结果表明：在影响蚀刻作用的诸因素中，样品位置的影响最显著，处理时间、微波功率其次，而系统压力的影响最弱。在本研究的范围内，杉木样品距谐振腔距离越近、等离子体处理时间越长、微波功率越高则蚀刻越严重；在３种等离子体中，Ｏ２等离子体蚀刻最严重，而Ｎ２等离子体最轻微，空气等离子体蚀刻介于两者之间。
Etching is induced by the microwave plasma treatment of the wood surface, and the magnitude of the etching is related to the level of ion energy, that is, the working conditions of the plasma and the type of plasma. The effects of microwave power, system pressure, sample position (distance from the resonator) and processing time on the wood etching of Chinese fir were discussed in this paper. The effects of N2, O2 and air plasma on the plasma etching were compared under the same working conditions. Effect of wood etching. The results show that among the factors that affect the etching effect, the position of the sample has the most significant influence. The treatment time, the microwave power and the system pressure have the weakest effects. Within the scope of this study, the shorter the distance between the Chinese fir sample and the resonant cavity, the longer the plasma treatment time and the higher the microwave power, the more severe the etching. In the three kinds of plasma, the O2 plasma etching is the most serious, while the N2 plasma The slightest, air plasma etch is in between.