本文介绍对电子元器件引线可焊性的四种测试方法,即电烙铁法、焊槽法、焊球法、润湿称量法的研究,初步找到了这四种测试方法彼此之间的对应关系,只要有一种测试方法的及格尺度确定,其它几种方法相应的及格尺度也可以随之确定。这样虽然采用不同的测试方法,却可以得到统一的测试结果。 This article describes four kinds of test methods for solderability of electronic components lead, that is, electric iron method, welding groove method, solder ball method, wetting weighing method, initially found the four test methods correspond to each other Relations, as long as there is a test method to determine the passing criteria, several other methods corresponding to the passing standard can also be determined. Although using different test methods, you can get a unified test results.