论文部分内容阅读
美国Nanodyne Inc公司新近开发成功晶粒尺寸为1~100nm超细WC复合粉末.据称,用其制造出印刷电路板用硬质合金钻头的使用寿命比常用同组分硬质合金钻头提高了3倍.
Recently, the United States Nanodyne Inc company successfully developed the grain size of 1 ~ 100nm ultrafine WC composite powder.It is said that the use of hard-alloy drill used in the manufacture of printed circuit board life expectancy than the same component carbide drill bit increased by 3 Times