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高容量密度和无卤素埋置电容材料3M公司宣布其高容量埋置电容材料(ECM)在美国DesignCon2012展出,应用它可使设计师们大大改善电路电源完整性和降低电磁干扰(EMI)。3M的ECM新材料将提供最高的电容密度和不含有卤素。电容密度的增加,设计师们可以使产品高频率的噪音减少,有助于设计师提供高保真、高频率和高速度的数字信号,适于各种高性能电子产品应用。
High-Density and Halogen-Free Buried Capacitor Materials 3M announced the launch of its high-capacity embedded capacitor material (ECM) at DesignCon 2012 in the US, enabling designers to dramatically improve circuit power integrity and reduce electromagnetic interference (EMI). 3M’s new material from ECM will provide the highest capacitance density and does not contain halogen. As capacitance densities increase, designers can reduce the product’s high frequency noise and help designers deliver high-fidelity, high-frequency and high-speed digital signals for a wide range of high-performance electronics applications.