从某种意义上说,集成电路制造设备就是物化了的集成电路制造技术。本文拟从设备的角度介绍日本超大规模集成电路(VLSI)制造技术的一些近况。目前,日本集成电路企业生产的64KRAM(线宽3～2微米)占世界产量的80％,不少企业又计划在一、两年内开始生产256KRAM(线宽1.5微米)、同时,正在研制中的VLSI的线宽已突破(小于)1微米而进入亚微米的阶段。因此,实现微米,亚微米级微细加工是日本集成电路制造技术面临的中心课题。电子束曝光是突破光波波长的局限,实现亚微米级图形加工的一个基本手段。但是,由于目前的电子束曝光机的加工速度慢,不适于 In a sense, integrated circuit manufacturing equipment is materialized integrated circuit manufacturing technology. This article intends to introduce some recent developments in manufacturing technology for VLSI in Japan from a device perspective. At present, 64KRAM (3 to 2 microns in line width) produced by Japanese IC companies account for 80% of the world’s output. Many companies plan to start production of 256KRAM (1.5-micron line width) in one or two years. At the same time, The VLSI linewidth has broken through (less than) 1 micron into the submicron stage. Therefore, to achieve micron, sub-micron micron processing is the Japanese integrated circuit manufacturing technology is the center of the problem. Electron beam exposure is to break through the limitations of light wavelength, sub-micron graphics to achieve a basic means. However, current electron beam lithography machines are not suitable for their processing speed