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在半导体湿法工艺中,后道清洗因使用有机药液而与前道有着明显区别。本文主要将以湿法清洗后道工艺几种常用药液及设备进行对比研究,论述不同药液与机台的清洗原理,清洗特点与清洗局限性。
In the semiconductor wet process, after the cleaning due to the use of organic liquid and before the road there is a clear distinction. This article will mainly wet process after the wet process several commonly used liquid and equipment for comparative study of different liquid and machine cleaning principles, cleaning characteristics and cleaning limitations.