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铝焊垫表面残留物的检测是确保铝焊垫质量的重要指标。俄歇电子能谱仪(AES)由于检测区域小、表面分析灵敏度高,被广泛用于集成电路(IC)芯片制造中铝焊垫的表面成分分析,但荷电效应的存在常常会影响俄歇分析的结果。铝焊垫分析过程中,消除或者减少荷电效应是保证俄歇分析结果正确的前提。从优化俄歇电子能谱仪分析条件(比如降低入射电压、倾斜样品载物台、Ar+离子中和)和使用辅助方法改善样品导电性两大方面,介绍了几种减少荷电效应的有效方法,提出了铝焊垫俄歇分析的基本流程。结果表明,此分析流程能有效提高分析效率,为业内俄歇分析人员提供借鉴。
Aluminum pad surface residue testing is to ensure the quality of aluminum pad an important indicator. Auger Electron Spectroscopy (AES) has been widely used for the surface composition analysis of aluminum pads in the manufacture of integrated circuit (IC) chips due to its small detection area and high surface analysis sensitivity. However, the presence of charge effects often affects Auger Results of the analysis. In the process of aluminum pad analysis, eliminating or reducing the charging effect is the precondition to ensure the correct result of Auger analysis. Several effective methods to reduce the charge-up effect are introduced, from optimizing the Auger electron spectroscopy analysis conditions (such as reducing the incident voltage, tilting the sample stage, neutralizing the Ar + ions) and using auxiliary methods to improve the conductivity of the sample , Put forward the aluminum welding Auger analysis of the basic process. The results show that this analysis process can effectively improve the efficiency of the analysis for the industry Auger analysts to provide reference.