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During the past six years comprehensive research programs have been conducted at the Beijing PolytechnicUniversity to provide a better understanding of heat transfer characteristics of existing and condidate cool-ing techniques for electronic and microelectronic devices.This paper provides a review and summary of theprograms with emphasis on direct liquid cooling.Included in this review are the heat transfer investigationsrelated to the following cooling modes:liquid free,mixed and forced convection,liquid jet impingement,flowingliquid film cooling,pool boiling,spray cooling,foreign gas jet impingement in liquid pool,and forced convectionair-cooling.
During the past six years comprehensive research programs have been conducted at the Beijing PolytechnicUniversity to provide a better understanding of heat transfer characteristics of existing and condidate cool-ing techniques for electronic and microelectronic devices. This paper provides a review and summary of theprograms with emphasis on direct liquid cooling.Included in this review are the heat transfer investigations correlated to the following cooling modes: liquid free, mixed and forced convection, liquid jet impingement, flowingliquid film cooling, pool boiling, spray cooling, foreign gas jet impingement in liquid pool, and forced convectionair-cooling.