相对于传统的Sn-Pb焊料,无铅焊料需要较高的焊接温度,而且润湿性差,另外免清洗助焊剂和水溶性助焊剂的固体含量低,活性温度高和活性区间窄。无铅焊料和助焊剂的特性决定了无铅波峰焊设备在结构和材料选用上有很大不同。通过对无铅波峰焊设备的各个部分的特点进行分析,为传统的旧波峰焊设备的改造提供参考。 Lead-free solders require a higher soldering temperature than conventional Sn-Pb solders and have poor wettability. In addition, no-clean fluxes and water-soluble fluxes have low solids content, high active temperature and narrow active range. The characteristics of lead-free solder and flux determine the lead-free wave soldering equipment in the structure and material selection are very different. By analyzing the characteristics of the various parts of the lead-free wave soldering equipment, it provides a reference for the transformation of the traditional old wave soldering equipment.